The NS83112A is a high-performance, Surface Acoustic Wave (SAW) Duplexer for LTE B12 application with low insertion loss and high isolation. 

The NS83112A uses Chip Scale Packaging (CSP) techniques to achieve the industry advanced 1.8 x 1.4 mm footprint and 0.55 mm typical height. 

The duplexer exhibits excellent power handling capabilities.